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Electronic Equipment , Design , Prototyping , Manufacture , Thick Film Microcircuits , RF & Microwave , Data telemetry , Electronic control mechanisms , PCB assembly , PCB modification , Chip & Wire , Electronic packaging , Optoelectronics , Hermetic packaging and welding , Volume manufacture , Wire bonding , Precision die attach , Multiple Layers , Precision Layer Trimming
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Cheyenne Godfrey
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